IT Home October 23 news: The US Department of Commerce announced yesterday that it plans to provide up to $389 million (ITHome note: approximately 2.602 billion RMB at current exchange rates) in R&D funding to 4 companies through the semiconductor R&D program under the US CHIPS and Science Act, to support R&D of power semiconductor devices and critical materials, with the relevant technologies to be applied in fields such as nuclear fusion power generation, AI data centers, and power infrastructure.
According to information released by the National Institute of Standards and Technology (NIST), the Commerce Department has signed funding intent letters with the 4 companies, and final funding still requires completion of subsequent procedures.
In this plan, nuclear fusion energy company Helion is to receive the highest proposed funding amount, reaching $175 million (approximately 1.17 billion RMB at current exchange rates), which will be used to develop high-voltage power semiconductors and advanced energy power modules to support its nuclear fusion power generation systems.
The other 3 companies are Commonwealth Fusion Systems, Vertical Semiconductor, and Sibelco, with proposed funding caps of $85 million (approximately 568 million RMB at current exchange rates), $73 million (approximately 488 million RMB at current exchange rates), and $56 million (approximately 375 million RMB at current exchange rates) respectively.
Specifically, Commonwealth Fusion Systems will use the relevant funds to develop materials for semiconductors, power electronics, embedded electronics for fusion diagnostic systems, and radiation-hardened electronic devices. Vertical Semiconductor will advance research on vertical gallium nitride (GaN) power semiconductors, with target applications including advanced computing devices and AI data center racks.
The materials supplier Sibelco will develop next-generation purification and finishing technologies for ultra-high-purity quartz. Such materials are used in crystal growth crucibles, process glassware, and other production equipment in semiconductor manufacturing, and their purity and processing quality affect the related manufacturing steps.
This funding is part of a $10 billion (approximately 66.882 billion RMB at current exchange rates) semiconductor R&D funding program approved by the US Congress in 2022. Reuters reported that in recent months, the US Department of Commerce has already provided 19 R&D grants to semiconductor companies through this funding program. As a condition of receiving the funds, the US government will take a minority stake in each recipient company in the final funding agreements, but without control or voting rights.