IT之家 October 27 news — According to a report by Taiwanese media Commercial Times today, citing supply chain sources,TSMC is considering raising the prices of its advanced packaging processes by 10% to 20%as surging AI demand keeps semiconductor supply chain capacity persistently tight.
The report noted that TSMC is preparing to implement a 10% to 20% price increase for its CoWoS (Chip on Wafer on Substrate) packaging services, a packaging technology widely used in advanced AI processors.
The report also pointed out that market demand has expanded from GPUs to CPUs and custom application-specific integrated circuits (ASICs), and that lengthened AI chip testing times have further increased pressure on packaging and testing capacity.
As chipmakers prioritize delivery schedules, suppliers are struggling to rapidly expand capacity,equipment lead times have extended from the previous 3 to 6 months to 6 to 8 months.。
IT之家 learned from the report that, according to cited analyst estimates, TSMC's CoWoS monthly capacity is expected to exceed 130,000 wafers in 2026 and reach 200,000 in 2027.